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Etching Machine

ET12-XS2E2S1A

Machine Features

1. Position‑and‑speed‑controllable swing‑arm sprays chemical solutions for improved etching uniformity

2. Layer‑structured reaction chamber allows spraying of multiple chemical solutions inside the single chamber with efficient recovery of chemical solutions

3. Stack‑type layout for compact footprint; supporting up to four etching units

Applications

Etching process for compound semiconductors, power‑devices, MEMS components, advanced packaging and RF integrated‑circuits

Semiconductor Industry

Technical Data Sheet

Machine Model	Etching Machine ET12-XS2E2S1A
Wafer Cassette Quantity	2cs&2lp
Configuration	4 Etch Units
Wafer Type	Round Wafers
Wafer Size（mm）	50-300
Throughput（WPH）	90
Chemical Solution	H2O2、Strong Acids and Alkalis
Substrate Material	Si、Glass、Sapphire、GaN、GaAs、SiC、LiTaO3、Li3PO4
Applicable Processes	Wet Etch
Drying Mode	Spin Dry+N2 Dry

Sales Hotline

+86-400-666-4000