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Automatic Wafer Laser Grooving Machine

Machine Features

1. Adopts specially‑customized pulse‑width laser processing tailored for wafer laser machining to improve kerf quality, with the heat‑affected‑zone (HAZ) below 2 μm

2. Multiple laser micromachining technologies are integrated to ensure processing efficiency and process quality; multiple cutting‑function selections

3. Equipped with a combined Mask‑and‑TOP‑HAT beam‑shaping module and a dual‑optical‑path processing module

4. High‑precision visual‑inspection system

5. Compatible with 8‑inch and 12‑inch wafers

6. Supports automatic loading and unloading, unattended fully‑automatic operation for mass production

Applications

Laser grooving machine for Low‑k, Non‑Low‑k and GaN wafers.

Semiconductor Industry

Technical Data Sheet

Machine Model	Automatic Wafer Laser Grooving Machine
Wafer Size	8inch、12inch
Processing Speed	100mm/s~600mm/s
Processing Accuracy	≤±3μm
Travel Range	600mm*600mm
Laser	532nm，25W
Equipment Utilization	＞0.95

Sales Hotline

+86-400-666-4000