Cookies Consent

Required Cookies (Necessary)
Optional Cookies (statistical analytics cookies)

Enabling this setting confirms your approval for cookie implementations throughout the Han’s Laser website, together with the transfer of your personal data to third countries. You may withdraw this authorisation via this interface at any time. Kindly note that all data processing undertaken pursuant to this consent shall remain legally valid prior to your withdrawal.

Privacy Policy Legal Statement
Automatic Wafer Laser Grooving Machine
Applications

Automatic Wafer Laser Grooving Machine

Machine Features

1. Adopts specially‑customized pulse‑width laser processing tailored for wafer laser machining to improve kerf quality, with the heat‑affected‑zone (HAZ) below 2 μm

2. Multiple laser micromachining technologies are integrated to ensure processing efficiency and process quality; multiple cutting‑function selections

3. Equipped with a combined Mask‑and‑TOP‑HAT beam‑shaping module and a dual‑optical‑path processing module

4. High‑precision visual‑inspection system

5. Compatible with 8‑inch and 12‑inch wafers

6. Supports automatic loading and unloading, unattended fully‑automatic operation for mass production


Applications

Laser grooving machine for Low‑k, Non‑Low‑k and GaN wafers.


Semiconductor Industry
Technical Data Sheet

Machine   Model

Automatic   Wafer Laser Grooving Machine

Wafer   Size

8inch、12inch

Processing   Speed

100mm/s~600mm/s

Processing   Accuracy

≤±3μm

Travel   Range

600mm*600mm

Laser

532nm，25W

Equipment   Utilization

＞0.95


Recommended Products
Contact
Contact Us
Phone
Sales Hotline
+86-400-666-4000
Top