


The time range for 3D printing a metal artwork is very wide, ranging from 2.5 hours to several days or more.

Laser sapphire cutting, particularly for applications such as LED chip substrates, watch lenses, and smartphone camera protective lenses

Glass laser welding is an advanced process with high technical demands and difficulty, primarily reflected in the following aspects:

Handheld laser welding machine is an efficient welding equipment that can complete a large amount of welding works in a very short time. This is mainly because laser welding is a non-contact welding technology that can complete welding work without direct contact with the surface of the units.

Slicing is the process of dividing a semiconductor wafer into individual chips, usually carried out after the wafer has completed the previous process and electrical performance testing. As the first step in semiconductor packaging, the quality of slicing will directly affect the final reliability of the packaged product.

The Han's laser CO2 laser drilling machine can be applied to the internal X+N+X ordinary HDI blind hole processing (subtractive process) of products in fields such as 5G communication, industrial control, automotive intelligence, and consumer electronics.


The main difference between laser welding and argon arc welding is the difference in technical principles.

In summary, semiconductor laser is a device that uses semiconductor materials as the working substance and excites the laser through current injection. It is currently the most common, widely used, and smallest type of laser.

The core of laser welding for dissimilar materials lies in utilizing its extremely high energy density and excellent controllability to overcome the significant physical and chemical property differences between different materials.