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Han's Laser Fully Automatic Wafer Edge ID Marking System (Four Boxes Model)

Oct 22, 2024
This equipment is suitable for laser processing of wafer materials such as silicon, silicon carbide, silicon dioxide, gallium nitride, etc. 
It is equipped with electric focusing, allowing for height adjustment based on product thickness. 
It also comes with a professional calibrator that can set the edge marking position freely, enabling curved marking.




The system is equipped with a dual-arm manipulator and carries four material boxes. 
The manipulator is equipped with a mapping function that can automatically detect stacked and misaligned wafers. 
Through fully automatic loading and unloading, automatic positioning and marking, and automatic inspection, it achieves comprehensive automation and enhances processing efficiency.

For the laser light source, users can choose between UV or green lasers.
Regarding safety performance, the equipment is equipped with an INTERLOCK function to ensure the safety of both the operator and the machine.

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