Products Series
Products
Offline PCBA (FPCBA) Cutting machine HDZ-UVC3030
1. With high-performance UV lase and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
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EP-IRPS-20
1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics.
2. LCD, OLED screen cutting (C, R, U angle cutting).
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.
2. LCD, OLED screen cutting (C, R, U angle cutting).
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.
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Built-in flip PCB marking system HDZ-PCB100F
Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so on.
Marking on the Rigid and flexible printed circuit board (PCBAs).
Support 1D barcodes, 2D Matrix, QR codes, logo, batch number marking.
Marking on the Rigid and flexible printed circuit board (PCBAs).
Support 1D barcodes, 2D Matrix, QR codes, logo, batch number marking.
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Automated laser marking machine
1, High precision, precise pick and place, 8 materials flipped, laser marking on 3 sides synchronously.
2, High efficiency, 4 stations linkage, marking time 1.12pcs/s.
3, Strong stability, 99% product yield under high-speed operation.
2, High efficiency, 4 stations linkage, marking time 1.12pcs/s.
3, Strong stability, 99% product yield under high-speed operation.
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Semiconductor laser welder - WFD10/25/50/100/1000
The WFD series is a diode laser that uses diode materials to illuminate between energy bands. Two parallel mirror surfaces inside the diode are formed as a resonant cavity, which illuminates the light, and outputs laser of wavelength 915 nm.
With fiber t
With fiber t
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HFM-K Series 200-300W Pulse Fiber Laser
HFM series is a series of pulse fiber laser independently developed by Han's Laser and designed with MOPA scheme.
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Online PCBA/FPCBA laser cutting machine HDZ-CL4030
Product Characteristics
1. With high-performance UV laser and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
1. With high-performance UV laser and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
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Ultrafast Glass Cutting and Drilling Machine HDZ-GCF3000
1、Glass thickness: 0.1-1.2mm
2、Edge breakage size: ＜0.005mm
3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL<50µm, T=0.7mm Corning
4、Non-contact processing, little damage to the material, high cutting precision.
2、Edge breakage size: ＜0.005mm
3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL<50µm, T=0.7mm Corning
4、Non-contact processing, little damage to the material, high cutting precision.
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Laser drilling machine
1.Realize X, Y, Z motion control in three directions;
2.Real-time controls the rotation of the laser and changes of processing tilt angle;
3. By setting different combination of processing parameters, users can realize various irregular drilling.
2.Real-time controls the rotation of the laser and changes of processing tilt angle;
3. By setting different combination of processing parameters, users can realize various irregular drilling.
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PD5050-HLR-150
It is mainly used for laser cutting of metal plates such as stainless steel plates, ordinary carbon steel plates, aluminum plates, nickel plates, etc.; it cannot be used for processing containers of metals and alloys with flammable and explosive materials
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PD5060-CO2-60-CCD
Laser cutting is the process of cutting material by means of electron discharge as the energy source. The following diagram describe the principle of Laser cutting Succinctly.
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PL30-HLR-150
Mainly used for laser cutting of metal sheet, such as stainless steel, plain carbon steel plate, aluminum plate, etc.;
Can be used to cut aluminum oxide, aluminum nitride ceramics.
Cutting Product Industry:
IT industry products, such as laptops, mobile
Can be used to cut aluminum oxide, aluminum nitride ceramics.
Cutting Product Industry:
IT industry products, such as laptops, mobile
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Trim automated assembly machine
The machine is mainly used in the assembly and welding of the fixed structure parts of the back cover camera of IT products such as mobile phones and PAD.
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Rcam Trim automated assembly machine
The machine is mainly used in the assembly and welding for the fixed structure parts of the back cover camera of IT products such as mobile phones and PADs.
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MARS-10J/20J
1. Can be suitable for a variety of materials: steel, aluminum, silver, gold, silicon.
2. Suitable for various industries:
Electronic components industry
Medical device industry
Glasses, watch and clock industry
IC card industry
Jewelry industry
2. Suitable for various industries:
Electronic components industry
Medical device industry
Glasses, watch and clock industry
IC card industry
Jewelry industry
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EP-15-THG-S
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
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YLP-MDF-152
The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch industry, jewelry industry, mould industry etc.
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EP-15-THG-F
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
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EP-15-THG-D
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
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Applications
About Us
HAN'S LASER INTRODUCTION
Han's Laser Technology Industry Group Co., Ltd, a public company which was established in 1996, has now became the flagship of Chinese national laser industry and the world's famous laser equipment manufacturer.
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2486
Patent
10746
Professional
500000
Research
News
Application of Laser Technology in Semiconductor Wafer Slicing Process
Slicing is the process of dividing a semiconductor wafer into individual chips, usually carried out after the wafer has completed the previous process and electrical performance testing. As the first step in semiconductor packaging, the quality of slicing will directly affect the final reliability of the packaged product.
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Han's Laser CO2 laser drilling machine
The Han's laser CO2 laser drilling machine can be applied to the internal X+N+X ordinary HDI blind hole processing (subtractive process) of products in fields such as 5G communication, industrial control, automotive intelligence, and consumer electronics.
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