Solid Picosecond Laser
Brief Description
It is widely used in processing of brittle materials and super-hard materials to fully solve the micro processing bottleneck of panel display, photovoltaic, semiconductor and other industries
Categories
UV Nanosecond/Femtosecond Laser
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Product features
Firm and durable industrial mechanical design
Maximum output power 50W@1064nm, 30W@355nm...../532nm
Ultrashort pulse output <10ps
Burst pulse train mode output, the maximum number of 63
Single pulse - 4MHz repetition frequency
Available frequency division according to the demand, the maximum number of 31
POL/POD output & computer remote control
Optional dual-wavelength output function
Temperature and humidity detection self-protection function
Applications
1. Micromachining of brittle materials such as glass, sapphire, ceramics, etc.
2. Fine marking of ultra-precise mark points and tiny invisible QR code (0.2mm*0.2mm) on the glass materials.
3. Traceable marking of anti-acid corrosion, anti-oxidation and other functions on metal medical instruments.
4. Cutting and drilling of plastics, oxides and organics, or surface coating removal.
5. External LOGO of high-end electronic products.
6. Fine molding of super-hard materials.
7. Depth processing on metallic materials without using chemical corrosion.
Firm and durable industrial mechanical design
Maximum output power 50W@1064nm, 30W@355nm...../532nm
Ultrashort pulse output <10ps
Burst pulse train mode output, the maximum number of 63
Single pulse - 4MHz repetition frequency
Available frequency division according to the demand, the maximum number of 31
POL/POD output & computer remote control
Optional dual-wavelength output function
Temperature and humidity detection self-protection function
Applications
1. Micromachining of brittle materials such as glass, sapphire, ceramics, etc.
2. Fine marking of ultra-precise mark points and tiny invisible QR code (0.2mm*0.2mm) on the glass materials.
3. Traceable marking of anti-acid corrosion, anti-oxidation and other functions on metal medical instruments.
4. Cutting and drilling of plastics, oxides and organics, or surface coating removal.
5. External LOGO of high-end electronic products.
6. Fine molding of super-hard materials.
7. Depth processing on metallic materials without using chemical corrosion.
| Model | HL-PS-1064-20/30/50 | HL-PS-532-12/18/30 | HL-PS-355-8/12/20 |
| Output parameters | |||
| Wavelength | 1064nm | 532nm | 355nm |
| Power | 20~50 W @ 1000kHz, typical value | 12~30W @ 1000kHz, typical value | 8~20 W @ 1000kHz, typical value |
| Repetition frequency | Single pulse up to 4000 kHz | ||
| Pulse width | <10ps | ||
| Pulse stability | <2% rms @ 1000 kHz, typical value | ||
| Beam parameters | |||
| Spatial pattern | TEM00 | ||
| M2 | <1.3 | ||
| Polarization ratio | 100:1 (vertical) | 100:1 (horizontal) | 100:1 (vertical) |
| Spot diameter | 2.1 mm ±0.2mm | 2.4 mm ±0.3mm | 2.4 mm ±0.3mm |
| Divergence full angle | <2 mrad | ||
| Spot symmetry | >85% | ||
| Beam pointing | < 25 µrad/°C | ||
| Working conditions/requirements | |||
| Power supply | 100-240V,50 -60Hz | ||
| Ready time | Standby to ready<10 minutes; Cold start to ready<30 minutes | ||
| Temperature range | Working: 18~35°C; Non-working: 0~50°C | ||
| Humidity | 10—90%, no condensation | ||
| Cooling requirements | Water cooling, chiller accuracy ±0.1°C & flow rate≥6L/min | ||
| Overall heat consumption | <1000 W | ||
| Size | |||
| Size of laser head (L × W × H) | 700 x 400 x 163 mm | ||
| Weight of laser head | 56 kg | ||
| Size of controller (L × W × H) | 440 x 432 x 132mm | ||
| Weight of controller | 19.3kg | ||
Sample
Direct cardiovascular incision
Depth character marking behind stainless steel watch
