Press release
25
2025,12
Application of Laser Technology in Semiconductor Wafer Slicing Process
Slicing is the process of dividing a semiconductor wafer into individual chips, usually carried out after the wafer has completed the previous process and electrical performance testing. As the first step in semiconductor packaging, the quality of slicing will directly affect the final reliability of the packaged product.
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19
2025,12
Han's Laser CO2 laser drilling machine
The Han's laser CO2 laser drilling machine can be applied to the internal X+N+X ordinary HDI blind hole processing (subtractive process) of products in fields such as 5G communication, industrial control, automotive intelligence, and consumer electronics.
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04
2025,12
Difference between laser welding and argon arc welding
The main difference between laser welding and argon arc welding is the difference in technical principles.
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28
2025,11
What is a semiconductor laser?
In summary, semiconductor laser is a device that uses semiconductor materials as the working substance and excites the laser through current injection. It is currently the most common, widely used, and smallest type of laser.
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21
2025,11
How to achieve dissimilar material welding with laser
The core of laser welding for dissimilar materials lies in utilizing its extremely high energy density and excellent controllability to overcome the significant physical and chemical property differences between different materials.
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