Products
HDZ-WUVC100
Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing
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EP-IRPS-20
1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics.
2. LCD, OLED screen cutting (C, R, U angle cutting)
3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks
4. Metal medi
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HDZ-SIC200
Applicable for the packaged IC marking of DIP, QFN and BGA.
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HDZ-PCB100
Applicable for the digital products, wearable devices, automobile PCB, mobile phone PCB, FPC and so on.
Marking on the Rigid and flexible printed circuit board (PCBs).
Support 1D barcodes, 2D Matrix, QR codes, logo, batch number marking.
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HDZ-WAF600
Applicable for the 6-inch, 8-inch and 12-inch wafer marking
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Automated laser marking machine
1, High precision, precise pick and place, 8 materials flipped, laser marking on 3 sides synchronously.
2, High efficiency, 4 stations linkage, marking time 1.12pcs/s.
3, Strong stability, 99% product yield under high-speed operation.
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Gap&Step
The machine is mainly used for the Gap & Step inspection for power plugs
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Semiconductor laser welder - WFD10/25/50/100/1000
The WFD series is a diode laser that uses diode materials to illuminate between energy bands. Two parallel mirror surfaces inside the diode are formed as a resonant cavity, which illuminates the light, and outputs laser of wavelength 915 nm.
With fiber t
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MPS-3015D
It is suitable for sheet metal processing, kitchen appliances, sheet metal case cabinets, lighting advertising, electrical equipment and all kinds of metal products processing industry.
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Laser drilling machine
1.Realize X, Y, Z motion control in three directions;
2.Real-time controls the rotation of the laser and changes of processing tilt angle;
3. By setting different combination of processing parameters, users can realize various irregular drilling.
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PB80
The laser power source first points the pulsed xenon lamp, and discharges the xenon lamp pulse through the laser power source to form a certain frequency, a pulse wave of a certain pulse width, and the light wave is radiated onto the Nd3+:YAG laser crysta
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PD5050-HLR-150
It is mainly used for laser cutting of metal plates such as stainless steel plates, ordinary carbon steel plates, aluminum plates, nickel plates, etc.; it cannot be used for processing containers of metals and alloys with flammable and explosive materials
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PD5060-CO2-60-CCD
Laser cutting is the process of cutting material by means of electron discharge as the energy source. The following diagram describe the principle of Laser cutting Succinctly.
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PL30-HLR-150
Mainly used for laser cutting of metal sheet, such as stainless steel, plain carbon steel plate, aluminum plate, etc.;
Can be used to cut aluminum oxide, aluminum nitride ceramics.
Cutting Product Industry:
IT industry products, such as laptops, mobile
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SP0201-CO2-30
Remove the insulating layer or enamel coat of the wires.
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SP0201-YLP-20
Remove the insulating layer or enamel coat of the wires.
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MPS-3015C
It is suitable for sheet metal processing, kitchen appliances, sheet metal case cabinets, lighting advertising, electrical equipment and all kinds of metal products processing industry.
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PB300CE
PB series utilizes a laser source that excites Nd: YAG crystal using a pulsed Xenon lamp that resonates to create a laser with a wavelength of 1064 nm.
With good beam quality, fine laser spot, strong penetration and fiber transmission, an excellent non-c
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W150G
W150G utilizes a laser source that excites Nd: YAG crystal using a pulsed Xenon lamp that resonates to create a laser with a wavelength of 1064 nm.

With good beam quality, fine laser spot, strong penetration, and fiber transmission, an excellent non-co
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PG3
The PG3 is a wide pulse green laser with a fiber-coupled output. Thanks to its small beam diameter, superior beam quality,
and short focal length, the PG3 produces uniform depth and consistent welding on highly reflective metals such as gold, silver, and
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SFP300
FP series is a new generation near-infrared semiconductor pumped fiber laser. With good beam quality, fiber transmission and high electro-optical conversion efficiency, It is mainly used for rapid welding thin materials.
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MOLD 301
It is commonly applied to mold manufacturing industries including mobile phone, digital product, automobile and motorbike.
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MOLD 302
It is commonly applied to mold manufacturing industries including mobile phone, digital product, automobile and motorbike.
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Trim automated assembly machine
The machine is mainly used in the assembly and welding of the fixed structure parts of the back cover camera of IT products such as mobile phones and PAD.
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Rcam Trim automated assembly machine
The machine is mainly used in the assembly and welding for the fixed structure parts of the back cover camera of IT products such as mobile phones and PADs.
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Automated weld SP to BAND
The machine is mainly used for mobile phone SP to BAND welding.
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FP300
FP series is a new generation near-infrared semiconductor pumped fiber laser. With good beam quality, fiber transmission and high electro-optical conversion efficiency, It is mainly used for rapid welding thin materials.
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FP150
FP series is a new generation near-infrared semiconductor pumped fiber laser. With good beam quality, fiber transmission and high electro-optical conversion efficiency, It is mainly used for rapid welding thin materials.
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MPS-3015DT
It is suitable for industries such as sheet metal processing, kitchen appliances, sheet metal chassis, cabinets, lighting advertising, electrical equipment and various metal products processing.
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SFP150
FP series is a new generation near-infrared semiconductor pumped fiber laser. With good beam quality, fiber transmission and high electro-optical conversion efficiency, It is mainly used for rapid welding thin materials.
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PB25CE
The laser power source first points the pulsed xenon lamp, and discharges the xenon lamp pulse through the laser power source to form a certain frequency, a pulse wave of a certain pulse width, and the light wave is radiated onto the Nd3+:YAG laser crysta
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MARS-10J/20J
1. Can be suitable for a variety of materials: steel, aluminum, silver, gold, silicon.
2. Suitable for various industries:
Electronic components industry
Medical device industry
Glasses, watch and clock industry
IC card industry
Jewelry industry
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G20
1. Various metal materials, part of non-metal materials.
2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.
•Ele
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YLP-H20
1. Various metal materials, part of non-metal materials.
2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.
•Ele
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EP-15-THG-S
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
4. Removal of metal or non-
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UV-3C
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
4. Removal of metal or non-
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YLP-MDF-152
The YLP-MDF-152 laser marker is mainly applied on the sample which is not flat, such as column, sphere, irregular surface, smoothness and fineness such as clock and watch industry, jewelry industry, mould industry and bitmap proce.
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HANS1500D
For white plastic caps, marking QR with size 11mm*11mm, marking contents is less than 35 characters, this system efficiency is about 600-800pcs/minute. Real productivity will have some difference according to plastic caps size, material, color, marking te
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HANS600D
The whole machine can cover 6-9 channes, productivity for single channel is ≥ 240pcs/min.
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EP-15-THG-F
1. Marking of electronic products’ LOGO, model, place of origin and so on
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm
3. PCB marking and cutting
4. Removal of metal or non-met
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EP-15THG-D
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
4. Removal of metal or non-
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CO2-H120
Widely used in
● industrial gifts,
● garment leather
● food packaging,
● electronic components
● PCB semiconductors
● crystal glass
● electronic devices
● plastic film buttons, etc.

Marking and engraving materials can be
● paper, leather, wood
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CO2-G10
It can engrave non-metallic materials and partial metal materials, widely applied to food packaging, drink packaging, medicine packaging, architectural ceramics, clothing accessories, leather, button, textile cutting, gifts and crafts, rubber product, sto
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HV850C
Can be widely used in automation machine parts, molds, medical, electronics, machinery, automotive, aircraft, aerospace, shipbuilding, defense and other fields of product processing.
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HT710B
Precision grilling & milling
3C industrial parts processing
Auto parts processing
Precision mold processing medical industry parts processing
Aerospace parts processing
Other precision parts processing
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HT710
Mobile phone backplane, plate, border processing
Ipad floor processing
Notebook computer floor processing
Communication cavity parts processing
Aluminum alloy metal parts processing
Automative parts processing (engine cavity)
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HL650
Mobile phone panel processing / Precision keypad, fixture batch processing / Electrode, jewelry glasses, clocks, small metal parts processing / PC, acrylic processing / Glass, sapphire, ceramic processing
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About Us
HAN’S LASER INTRODUCTION
Han’s Laser Technology Industry Group Co., Ltd, a public company which was established in 1996, has now became the flagship of Chinese national laser industry and the world’s famous laser equipment manufacturer.
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Patent
10746
Professional
500000
Research
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