Products

Laser marking machine for IC HDZ-SIC100/200

Features

  • Fully-automatic loading and unloading from magazine tomagazine, stable laser output, direction inspection function of intelligent vision system and sampling inspection function of marking effect
  • Friendly HMI
  • Imported double-head 20W fiber laser marking system; thegreen laser, UV laser, CO2 laser and other lasers are optional
  • With special fume removal device, it can quickly extract thefume and dust produced during marking to protect themarking area environment
  • It complies with CE MARK and SEMI standard

Application

  • Packaged IC marking of DIP, QFN and BGA

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Specifications

Machine modelHDZ-SIC100HDZ-SIC200
Marking scope320mm*160mm320mm*160mm
Product specificationL: 160-320mm; W: 30-80mmL: 160-320mm; W: 30-80mm
FontTFT and SHX; with font library module modification program
Final processing repeated positioning precision±0.1mm±0.1mm
UPH1200 pieces/h (idle)1200 pieces/h (idle)
Power supplyAC 220V, 50/60HzAC 220V, 50/60Hz
Air source0.6-0.8 MPa0.6-0.8 MPa
Overall dimension2525mm*1665mm*2000mm2515mm*1420mm*2000mm

 

Samples